January 10, 2024 -- Global Unichip Corporation (GUC), a leading global ASIC provider, has successfully taped out a complex 3D stacked die design on an advanced FinFET node process. The design, which ...
New VeritySEM ® 5i is the industry`s first in-line 3D CD SEM metrology system for volume production of advanced 3D devices Proprietary electron-filtering technology for high-aspect-ratio imaging, ...
Imec has demo-ed 3D stacked FinFETs on 300mm wafers using a sequential integration approach with a 45nm fin pitch and 110nm poly pitch technology. The top layer consists of junction-less devices ...
PITTSBURGH, Sept. 26, 2013 /PRNewswire/ -- ANSYS subsidiary Apache Design announced today that its RedHawk(TM) and Totem(TM) products have completed methodology innovations to be included in TSMC's ...
With chipmakers engaged in the development of 3D NAND and FinFET technologies, the global semiconductor market is set to expand another 25-35%, said an Applied Materials executive on September 5. Save ...
2-D MOSFETs have proven difficult to scale down to 20nm and beyond. In their place, 3D FinFET transistors have emerged as novel devices that can scale down to lower node sizes. 10nm process finFETs ...
The following is a special guest post by Steve Longoria, Senior VP of Worldwide Business Development at Soitec. It first appeared as part of the Advanced Substrate News special edition on FD-SOI ...
Intel Corp.’s move to a 22 nm Trigate vertical 3D FinFET (Fin-shaped field effect transistor) structure for use in nextgen CPUs means that for the first time the company may be a jump ahead of ARM Ltd ...
At this week’s IEEE IEDM 2018 conference, imec, the Leuven-based research and innovation hub has presented a first demonstration of 3D stacked FinFETs on 300mm wafers using a sequential integration ...
And that's good news for AMD folks. Samsung announced that it has begun mass production of advanced logic chips utilizing its 14 nm LPP (Low-Power Plus) process, the 2nd generation of the company's 14 ...
Samsung sends word that its production ramp-up of the 10-nanometer (nm) FinFET process technology is on track with steady high yields. They also mention 8nm and 6nm. Samsung has shipped more than ...
Tabula, the 3D programmable logic company where the third dimension is time, samples its first chips made on Intel’s 22nm finfet process in Q3. The chips perform bridge, search and switch functions ...
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