Electromagnetic interference (EMI) remains a critical challenge in the design and operation of modern electronic systems. The unwanted intrusion of electromagnetic fields can disrupt circuit ...

Electromagnetic compatibility (EMC) testing and modelling encompasses a range of methodologies devised to ensure that complex electronic systems function reliably in environments replete with diverse ...

In an exclusive interview with TI’s director of power management R&D, we explore the role of advanced packaging in low-voltage power electronics. From state-of-the-art materials and process technology ...

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is ...