The Master Bond EP3HTSDA-1 is a fast curing, one part, conductive epoxy system primarily for die attach applications. It is not premixed and frozen and has an unlimited working life at room ...
High-power semiconductor applications currently represent one of the highest growth sectors of any semiconductor technology, specifically because many of the key applications are driven by the ...
QPT just filed a patent for the “qAttach” process, a novel way to attach dies to heat spreaders or substrates (typically aluminum nitride (AlN)) that significantly reduces thermal resistance. The new ...
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