Business Wire

Applied Materials' New AdvantEdge Etch Cuts Transistor CD Variation by 50% to Wafer's Edge

SANTA CLARA, Calif.--(BUSINESS WIRE)--July 12, 2005--Applied Materials, Inc. today launched the industry's most advanced silicon etch technology, the Applied Centura(R) AdvantEdge(TM) system, ...
EDN

Seeking an Edge in Dielectric Etch

Applied Materials Inc. says it can do away with the middle etch stop layer in copper dual damascene/low k stacks and provide better critical dimension (CD) control with its new EnTek Centura chamber.
Business Wire

Nordson MARCH’s Plasma Confinement Ring Increases Etch Rate and Improves Treatment Uniformity for Wafer Processing

CONCORD, Calif.--(BUSINESS WIRE)--Nordson MARCH, a Nordson company (NASDAQ:NDSN), a global leader in plasma cleaning technology, introduces its Plasma Confinement Ring for wafer processing and wafer ...
Semiconductor Engineering

Controlling Uniformity At The Edge

Chipmakers want every part of the wafer to produce, or yield, good die. Advances in process technologies over the years have just about made this a reality, even as feature dimensions continue to ...
AZOM

NexGen Wafer Systems Introduces SERENO: A Versatile, High-Throughput Wet Etch and Clean Solution with Integrated Metrology for 6", 8", and 12" Substrates

NexGen Wafer Systems is excited to announce the launch of SERENO, its latest multi-chamber platform designed for Wet Etch and Clean applications. SERENO combines high performance with exceptional ...
Nanowerk

Deep Reactive Ion Etching (DRIE): Bosch Process, Cryogenic DRIE, and Applications

Deep reactive ion etching (DRIE) is a highly anisotropic plasma etching process that creates deep, near-vertical features in silicon and related microfabrication materials. DRIE extends ordinary ...