In high heat flux AI accelerator environments, Thermadite 800 LCPs can reduce chip temperatures by more than 15°C compared to conventional copper cold plates. The material also offers roughly 60% ...

Technology sets new benchmarks for cooling next-generation AI and high-performance computing systems. LANCASTER, Pa., Sept. 16, 2025 /PRNewswire/ -- Advanced Cooling Technologies, Inc. (ACT), a leader ...

Chinese researchers have reported a major advance in chip cooling that could sharply boost the performance of military radars and future wireless networks. On Tuesday, scientists from Xidian ...

Using hot water to cool supercomputers? Nvidia and others are doing it. It’s liquid cooling minus the water chillers.

A new KAIST roadmap reveals HBM8-powered GPUs could consume more than 15kW per module by 2035, pushing current infrastructure, cooling systems, and power grids to breaking point. The next generation ...

The rapid acceleration of artificial intelligence workloads is not only prompting widespread upgrades across data centers—it's also ushering in a new era of challenges in power delivery and thermal ...

Walk into a typical data center and one of the first things that jumps out at you is the noise—the low, buzzing sound of thousands of fans: fans next to individual computer chips, fans on the back ...

With data center demand growing, there is an increased focus on using more heat-intensive artificial intelligence-driven solutions to power facilities. This means there need to be better ways to keep ...

Amkor Technology is strengthening its position in advanced chip packaging. Vertiv is capitalizing on soaring demand for liquid cooling and power infrastructure. Both offer investors a unique way to ...