Electronics Weekly

Imec and ASML pattern sub-20nm pitch metal layers in one exposure using High NA

Imec and ASML have patterned structures using High NA with the 0.55NA EUV scanner down to 9,5nm (19 nm pitch), random vias with 30nm center-to-center distance, 2D features at 22nm pitch, and a DRAM ...
Design-Reuse

Imec Presents Fundamentally New Way to Render Colors with Sub-micron Pixel Sizes that Revolutionizes Camera Performance

LEUVEN (Belgium), DECEMBER 11, 2023– This week at the 2023 International Electron Devices Meeting (IEEE IEDM 2023), imec, a world-leading research and innovation hub in nanoelectronics and digital ...
New Electronics

Imec demonstrates logic and DRAM structures using High NA EUV Lithography

Imec, the research and innovation hub, has patterned structures obtained after exposure with the 0.55NA EUV scanner in the joint ASML-imec High NA EUV Lithography Lab in Veldhoven, the Netherlands.
Optics

Fujifilm and imec develop new photoresist technology for organic semiconductors enabling submicron patterns

New technology for organic semiconductor and OLED production is compatible with i-line lithography. FUJIFILM Corporation and imec have developed a new photoresist technology for organic semiconductors ...
New Electronics

Imec demonstrates combined VIS & NIR spectral camera system

This year's SPIE Photonics West will see imec showcase the world’s first multi-sensor hyperspectral camera system that covers both the visual and red/near infrared spectral ranges. With a ...