Engineers have long used thermal-cycle testing determine the reliability of PWBs (printed wire boards). Traditionally, engineers have used thermal-cycling ovens, liquid to liquid and fluidized sand, ...
The Fairchild MicroFET 2×2 dual is a 2mm x 2mm package based on Molded Leadless Packaging (MLP) technology. This technology is often used for power-related products due to its low package height and ...
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