A research team affiliated with UNIST has reported a new simulation tool to better understand how liquid-phase chemical ...

Novel semiconductor technologies are creating complex process flows, which are needed to support the manufacturing of advanced 3D semiconductor structures. It can be helpful to model process flows, ...

Nowadays, there are many interconnects in IC chips. One of the packaging goals is to connect an IC to the next level of subsystem circuitry (package substrates/print circuit boards). Mass reflow (MR) ...

Power electronics design is a critical aspect of modern engineering, influencing the efficiency, reliability, and performance of numerous applications. Developing circuits that meet stringent ...

Process chain for new SMC structural simulation approach demonstrated for Spirit AeroSystems reference wing rib redesigned to use carbon fiber SMC (C-SMC). Photo Credit, all images: Simutence, ...

Engineers working in the emerging areas of advanced air mobility (AAM) and electric vertical take-off and landing (eVTOL) may be in uncharted skies, literally and figuratively. While transforming ...

One of the biggest bottlenecks in the software development process for electronic products is that hardware is not available until late in the cycle. That means embedded software developers need to ...