Scientists have expanded on a longstanding model governing the mechanics behind slip banding, a process that produces strain marks in metals under compression, gaining a new understanding of the ...

Modeling how cars deform in a crash, how spacecraft responds to extreme environments, or how bridges resist stress could be made thousands of times faster thanks to new artificial intelligence that ...

Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...