With the advancement of nanotechnology, understanding surface properties at the nano- and sub-nanoscale has become increasingly important. Characteristics such as topography and roughness play a ...
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Global challenge reveals vast differences in measuring surface roughness and topography
Anyone who has slipped on a polished floor or felt their tires spinning in the snow knows instinctively the importance of surfaces. Certainly those in manufacturing—be it of robots, running shoes, or ...
In integrated circuit manufacturing, chemical mechanical polishing (CMP) is used to control the surface roughness of wafers and other substrates—a key factor influencing the reliability of final ...
Anyone who has slipped on a polished floor or felt their tires spinning in the snow knows instinctively the importance of surfaces. Certainly those in manufacturing—be it of robots, running shoes, or ...
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