FREMONT, CA / ACCESSWIRE / January 5, 2023 / Aehr Test Systems (NASDAQ:AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it has ...
PI introduces miniaturized alignment engine platform for scalable, parallel E/O wafer-level test Parallel piezo aligners with fly height sensors enable faster PIC wa ...
FREMONT, Calif., Dec. 07, 2022 (GLOBE NEWSWIRE) -- Aehr Test Systems (NASDAQ: AEHR), a worldwide supplier of semiconductor production test and reliability qualification equipment, today announced it ...
The pre-aligner determines wafer position and orientation in less than half a second while mechanical pre-aligners must typically spin wafers for several seconds. NotchMax, the newest member of the ...
Cognex at Semicon Japan announced the In-Sight 1820 vision-based wafer pre-aligner. Utilizing proprietary Cognex NotchMax alignment technology, the 1820 vision system provides precise noncontact ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
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