Kulicke & Soffa Industries Inc. (K&S) today announced that Amkor Technology Inc. of Chandler, Ariz., will license its wafer level packaging technology from Flip Chip Technologies LLC (FCT) for its ...

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Deutsche Bank posted its first loss in four years in the second quarter after setting aside 1.3 billion euros ($1.41 billion) as a provision for a protracted investor lawsuit over its Postbank ...

MUNICH — The Karl Suss unit of Suss MicroTec AG here announced successful use of a photoresist from Dow Chemical Co. in applying a low-k dielectric material on 300-mm wafers for interconnect bumping ...

Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing... China's homegrown ...

Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on ...

TEMPE, Ariz.--(BUSINESS WIRE)--Amkor Technology, Inc. (Nasdaq: AMKR) today announced that it has completed the acquisition of NANIUM S.A., a world class provider of wafer-level fan-out (WLFO) ...

North Korea's internet is experiencing a major outage on Saturday, said a UK-based researcher, adding that the cause may be may be internal rather than a cyberattack.

The global advanced packaging market has experienced growth due to several factors such as an increase in demand for miniaturization and expansion of the consumer electronics sector. The notable ...

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